Electronic semiconductor solutions
1. Semiconductor Equipment Components:
Semiconductor components are complex structures composed of thousands of parts, and the performance, quality, and precision of these parts collectively determine the reliability and stability of the equipment. These parts have extremely high precision requirements and often use difficult-to-machine materials such as tungsten, molybdenum, tantalum, and niobium. They require cutting tools with higher strength and better wear resistance.
2. Semiconductor Targets and Ion Implantation Parts:
Many semiconductor targets consist of difficult-to-machine materials such as tungsten, molybdenum, tantalum, niobium, titanium, and ruthenium. These materials have high melting points, and the oxide layers on various refractory metal ingots are tough and rough, leading to increased impact and vibration during cutting. This makes cutting tools prone to chipping and damage. Tungsten-molybdenum metals are chemically active, with strong affinity, leading to chip adhesion during cutting, exacerbating tool wear. The sticking phenomenon is particularly severe for niobium and tantalum materials. Tungsten-molybdenum refractory metals are brittle at room temperature, and their sintered products produce powdery chips during cutting, with high hardness resulting in severe tool wear.
Rheniumet Precision, as a specialized supplier of cutting tools for difficult-to-machine materials, provides a series of solutions to customers through the research and effective combination of tool materials, tool geometry parameters, and coating technologies.
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