Rare and Precious metal
Copper-molybdenum-copper (CMC)
Classification:
Heat sink material
Accessories:
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Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.
Advantages of copper-molybdenum-copper CMC electronic packaging materials:
This material has adjustable thermal expansion coefficient, high thermal conductivity and excellent high temperature resistance. The production process generally adopts rolling compounding, electroplating compounding, explosive forming and other methods. Mainly used as heat sink, lead frame and bottom expansion and heat conduction channel of multilayer printed circuit board (PCB).
Performance:
|
Type |
Material |
Density |
Thermal conductivity |
Thermal expansion coefficient |
| Copper metal laminate |
1:1:1 |
9.32 |
305(xy)/250(z) |
8.8 |
|
1:2:1 |
9.54 |
260(xy)/210(z) |
7.8 |
|
|
1:3:1 |
9.66 |
244(xy)/190(z) |
6.8 |
|
|
1:4:1 |
9.75 |
220(xy)/180(z) |
6 |
|
|
13:74:13 |
9.88 |
200(xy)/170(z) |
5.6 |
Product Message
Contact Information
Address: Building D1, Independent Pioneer Park, Tianyi Science and Technology City, 128 Chuangye Avenue, Zhuzhou City, Hunan Province
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